Micro-Relay Technology for Energy-Efficient Integrated Circuits by Hei Kam & Fred Chen

Author:Hei Kam & Fred Chen
Language: eng
Format: epub
Publisher: Springer New York, New York, NY

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~S 1.5

(S Ad −2 ⋅S gd 3 ⋅S CL⋅S h + S W 4/3 ⋅S h 2 ⋅S gd 8/3 ⋅S Ad −8/3 ) 0.5

As previously discussed, the energy-performance tradeoff curve is approximately a straight line with a slope of ~1.64. Furthermore, relay energy-efficiency is ultimately limited by the surface adhesion energy. Thus, one only needs to focus on how surface adhesion/minimum switching energy scales with contact dimple area, to understand how the relay energy-performance tradeoff changes with device scaling. As shown in Fig. 5.14, the surface adhesion force (which consists of van der Waals forces, capillary forces, and hydrogen bonds [19]) and hence the surface adhesion energy reduces with A d. This means that relay designs with lower beam stiffness, smaller contact dimple gap thickness, and therefore lower actuation area and supply voltage are feasible if a smaller contact dimple area is utilized.

Fig. 5.14Extracted average F A (with standard deviation indicated) vs. A d. The surface adhesion energy per unit dimple area (Γ/Ad) is extracted from surface force [12]. Each data point is obtained from measurements for more than ten relays with different L values

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